wafer sawing

Definitions

Electronics

  • A technique for cutting a semiconductor material into dies or chips, in which high-speed precision saws, with diamond-coated blades which can be thinner than one micrometer, are used. scribing is usually performed prior to sawing to facilitate cutting. Also called wafer slicing, or sawing.
  • synonymwafer slicing
http://www.dictionarycentral.com/definition/wafer-sawing.html